PCD diamond saw blade for beam panel saws 320x30 Z60 4,4/3,2 H8 TP (TCG)

Diamond Circular Saw PCD

Index: DSA.320030060.008

The circular saw from the DSA series features polycrystalline diamond (PCD) blades sharpened using an innovative laser ablation method. This technology guarantees an unprecedented sharpness of the cutting edges, resulting in perfect surface quality and edge finishing of the machined material without chipping. The use of PCD tips ensures up to 50 times longer lifespan compared to standard carbide saws, offering an excellent price-to-lifetime ratio and significant reduction of machine downtime. The saw has a mounting hole made to H7 tolerance, which minimises axial runout and directly enhances cutting precision. The improved design of expansion slots and noise-reducing notches reduces vibrations and ensures quieter, more stable operation. Special tooth support facilitates chip removal and strengthens the connection between the PCD tip and the tool body.

Key technical parameters and properties:

• Polycrystalline diamond (PCD) blades: The laser ablation sharpening method provides extreme sharpness, cutting cleanliness and up to 50 times longer lifespan than carbide tools.
• Trapezoidal-flat tooth geometry TP (TCG): Ensures precise, clean and chip-free formatting of coated and wood-derived materials.
• Mounting hole in H7 tolerance: Reduction of axial runout guarantees excellent guidance quality and cutting precision.
• Laser noise-reducing and expansion notches: The optimised profile of the compensation notches effectively dampens vibrations and noise during machining.
• Reinforced tooth support structure: Increased chip pocket capacity by 20% improves chip evacuation and strengthens the mounting of the PCD tip in the body.
• Regeneration capability: The design of the diamond tip allows for multiple sharpening, maximising lifespan and reducing unit production costs.

Application and material intended:

The tool is designed for efficient cutting and formatting of sheet materials in conjunction with a scoring saw.

Materials being processed: MDF and HDF boards (raw and laminated), chipboards (raw and laminated), plywood (raw and laminated), and HPL laminates.