PCD diamond saw blade for beam panel saws 530x80 Z72 4,8/3,5 H8 TP (TCG)

Diamond Circular Saw PCD

Index: DSA.530080072.008

A circular saw from the DSA series with polycrystalline diamond (PCD) blades, sharpened using a novel laser ablation method. This technology ensures unprecedented sharpness of the cutting edges, translating to ideal surface quality and edge finishing of the processed material without chipping. The use of PCD blades provides up to 50 times longer lifespans compared to standard carbide saws, offering an excellent price-to-lifetime ratio and significantly reducing machine downtime. The saw has a mount hole made to H7 tolerance, which minimizes axial runout and directly enhances cutting precision. An improved design of compensatory slots and damping notches reduces vibrations and ensures quieter, more stable operation. Special tooth support improves chip removal and strengthens the connection between the PCD blade and the tool body.

Key technical parameters and properties:

• Polycrystalline diamond (PCD) blades: The sharpening method via laser ablation ensures extreme sharpness, cutting cleanliness, and up to 50 times longer lifespan than carbide tools.
• Trapezoidal-flat tooth geometry TP (TCG): Ensures precise, clean, and chip-free formatting of coated and wood-based materials.
• Mount hole in H7 tolerance: Reduced axial runout guarantees excellent guiding quality and cutting precision.
• Laser damping and compensatory notches: The optimized profile of compensatory cuts effectively dampens vibrations and noise during processing.
• Reinforced tooth support construction: Increased chip pocket capacity by 20% improves chip evacuation and strengthens the holding of the PCD blade in the body.
• Regeneration capability: The design of the diamond blade allows for multiple sharpening, maximising lifespan and lowering unit production costs.

Application and material suitability:

The tool is intended for efficient cutting and formatting of panel materials in conjunction with a panel cutter.

Processed materials: MDF and HDF boards (raw and laminated), chipboards (raw and laminated), plywood (raw and laminated) and HPL laminates.