PCD diamond saw blade for sliding table panel saws 300x30 Z60 4,4/3,2 H6 TP (TCG)

Diamond Circular Saw PCD

Index: DSA.300030060.016

Circular saw from the DSA series with polycrystalline diamond (PCD) blades, sharpened using a revolutionary laser ablation method. This technology guarantees unprecedented sharpness of the cutting edges, which translates to perfect surface quality and edge finishing of the machined material without chipping. The use of PCD blades ensures up to 50 times longer lifespan compared to standard carbide saws, offering an excellent price-to-lifetime ratio and significant reduction in machine downtime. The saw features a mounting hole made with H7 tolerance, which minimises axial runout and directly enhances cutting precision. Improved design of expansion slots and noise-dampening cuts reduces vibrations and ensures quieter, more stable operation. Special tooth support enhances chip removal and strengthens the connection between the PCD plate and the tool body.

Key technical parameters and properties:

• Polycrystalline diamond (PCD) blades: The sharpening method via laser ablation provides extreme sharpness, cutting cleanliness and up to 50 times longer lifespan than carbide tools.
• TP (TCG) trapezoidal-flat tooth geometry: Ensures precise, clean, and splinter-free processing of coated and wood-based materials.
• Mounting hole within H7 tolerance: Reduction of axial runout guarantees excellent guiding quality and cutting precision.
• Laser noise-dampening and expansion cuts: Optimised profile of expansion cuts effectively dampens vibrations and noise during machining.
• Reinforced tooth support construction: Increased chip slot capacity by 20% improves chip evacuation and strengthens the fixing of the PCD plate in the body.
• Regenerability: The construction of the diamond plate allows for repeated sharpening, maximising lifespan and lowering unit production costs.

Application and material purpose:

The tool is designed for efficient cutting and formatting of sheet materials in cooperation with a subcutter.

Processed materials: MDF and HDF boards (raw and laminated), particleboards (raw and laminated), plywood (raw and laminated) and HPL laminates.