NANO saw blade for beam saws HM/HW 300x30 Z60 4,4/3,2 TP (TCG)

Circular saw HM for panel saw with superhard NANO carbide

Index: P30.300030060.PFW

Industrial circular saw with sintered carbide teeth from the P30 series, designed for cutting single boards and packs of materials such as MDF or HDF while maintaining the highest edge finishing quality. Equipped with trapezoidal-flat (TR/FZ | TCG) tooth geometry made of superhard NANO carbide by CERATIZIT®, which ensures extreme wear resistance and significantly extends the runs between sharpenings. Two stabilising (tensioning) rings and a hardened steel body guarantee maximum rigidity and stability of the saw during processing. The chamfered mounting hole made with a G6 tolerance allows for easy, quick, and precise mounting on the spindle. Laser-cut compensatory-silencing notches effectively reduce noise levels and vibrations. Saws from this series ideally cooperate with the diamond undercutter from the DSB series, creating a set that minimises machine downtime. The appropriate volume of carbide in the cutting plates allows for multiple sharpening, which significantly reduces the unit operating costs.

Key technical parameters and properties:

• Superhard NANO carbide CERATIZIT®: Dedicated carbide with increased wear resistance ensures significantly longer runs between sharpenings and excellent processing quality.
• Trapezoidal-flat tooth geometry (TR/FZ | TCG): Ensures precise and clean cutting of packaged and single MDF and HDF boards.
• Double tensioning rings and hardened body: Increase the stability and rigidity of the disc during operation under heavy load.
• Laser silencing notches: Laser-cut expansion-silencing slots drastically reduce noise levels and vibrations.
• Chamfered mounting hole (tolerance G6): High precision of the central hole with chamfering facilitates quick and accurate mounting on the spindle.
• Regeneration capability: The design of the carbide plate allows for multiple sharpening, which extends the overall tool lifespan.

Application and material purpose:

The tool is intended for cutting single and bundled materials on panel saws (format saws with pressure). It works excellently with the diamond undercutter from the DSB series.

Processed materials: MDF boards, HDF and other wood-based board materials.