PCD diamond saw blade for beam panel saws 300x80 Z60 4,4/3,2 H8 TP (TCG)

Diamond Circular Saw PCD

Index: DSA.300080060.008

Circular saw from the series DSA with polycrystalline diamond (PCD) blades, sharpened using an innovative laser ablation method. This technology guarantees an unprecedented sharpness of cutting edges, resulting in perfect surface quality and edge finishing of the processed material without chipping. The use of PCD plates ensures up to 50 times longer life compared to standard carbide saws, offering an excellent price-to-life ratio and significant reduction of machine downtime. The saw has a mounting hole made to H7 tolerance, which minimises axial runout and directly increases cutting precision. The improved design of the relief slots and damping notches reduces vibrations and ensures quieter, more stable operation. The special tooth support improves chip removal and strengthens the connection of the PCD plate with the tool body.

Key technical parameters and properties:

• Polycrystalline diamond (PCD) blades: The sharpening method using laser ablation ensures extreme sharpness, clean cutting, and up to 50 times longer life than carbide tools.
• TP Trapezoidal-Straight Tooth Geometry (TCG): Ensures precise, clean, and chip-free formatting of coated and wood-based materials.
• Mounting hole in H7 tolerance: Reduction of axial runout guarantees excellent guiding quality and cutting precision.
• Laser-cutting damping and expansion notches: Optimised profile of the relief notches effectively dampens vibrations and noise during machining.
• Reinforced tooth support construction: Increased chip cavity capacity by 20% improves chip evacuation and strengthens the fixation of the PCD plate in the body.
• Regeneration possibility: The diamond plate design allows for multiple sharpening, maximising lifespan and reducing unit production costs.

Application and material suitability:

The tool is intended for efficient cutting and formatting of panel materials in conjunction with a scoring cutter.

Processed materials: MDF and HDF boards (raw and laminated), particleboards (raw and laminated), plywood (raw and laminated), and HPL laminates.