NANO saw blade for beam saws HM/HW 300x80 Z72 4,4/3,2 TP (TCG)

HM Circular Saw for Panel Saws with Superhard NANO Carbide

Index: P30.300080072.PFW

Industrial circular saw with sintered carbide teeth from the P30 series, intended for cutting single boards and packs of materials such as MDF or HDF while maintaining the highest quality of edge finishing. Equipped with trapezoidal-flat (TR/FZ | TCG) geometry teeth made of superhard NANO carbide by CERATIZIT®, ensuring extreme abrasion resistance and significantly extending the runs between sharpening. Two reinforcing rings (tensioning) and a hardened steel body guarantee maximum rigidity and stability of the saw during processing. The chamfered mounting hole made with G6 tolerance enables easy, quick, and precise mounting on the spindle. Laser-cut compensating and damping notches effectively reduce noise and vibrations. Saws from this series work perfectly with the diamond scoring tool from the DSB series, creating a set that minimises machine downtime. The appropriate volume of carbide in the cutting plates allows for multiple sharpening, significantly reducing the unit operating costs.

Key technical parameters and properties:

• Superhard NANO carbide by CERATIZIT®: Dedicated carbide with increased wear resistance ensures significantly longer runs between sharpening and excellent processing quality.
• Trapezoidal-flat tooth geometry (TR/FZ | TCG): Ensures precise and clean pack and single board cutting of MDF and HDF.
• Double tensioning rings and hardened body: Increase the stability and rigidity of the disc during operation under heavy loads.
• Laser-cut damping notches: Laser-cut expansion and damping grooves drastically reduce noise and vibrations.
• Chamfered mounting hole (G6 tolerance): High precision of the central hole with chamfer facilitates quick and accurate mounting on the spindle.
• Re-sharpening capability: The design of the carbide plate allows for multiple sharpening, extending the overall tool life.

Application and material purpose:

The tool is designed for cutting single and bundled boards on panel saws (format saws with pressure). It works excellently with the diamond scoring tool from the DSB series.

Processed materials: MDF boards, HDF and other wood-based board materials.